职位描述
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RESPONSIBILITIES:
• Construct the product system architecture with the ability to make interdisciplinary trade-offs to optimize for the best cost/performance/time.
• Responsible for headset electrical detailed design (including test and debug) with cross-function team and ODM supplier, conduct design review before design release for production tooling
• Define product requirements and specifications (mechanical, electrical, acoustic, firmware) and test document as necessary to ensure desired quality and performance of the product
• Building an efficient communication bridge to ODM supplier with worldwide development teams across multiple disciplines (Product Manager, QA, Ops, 3rd party supplier etc.)
• Provide global technical support to other non-engineering functions on key technologies and past, present, and future products
• Develop new technologies/technology platforms
REQUIREMENTS
• 6 years experience in product development of electronic products, 2 years experience as a lead of ODM projects is a must.
• Bachelor degree in electrical engineering discipline or similar.
• Strong consumer electronic industrial background. Wireless and audio working experience will be a plus.
• Rich design experience for high volume manufacture of consumer electronic product.
• EDA experience in validating schematic and PCB/A layout, prototype bring-up and debugging between Engineering team and ODM, lead team to meet requirement of EMC/EMI, ESD, RF, reliability etc.
• Thorough understanding of, and ability to clearly explain, EE concepts such as A/D, DC/DC supply, RF gain compression, EMI noise suppression techniques, SWR and power measurement
• Strong electrical engineering background with clear understanding of software/firmware development. Track record of learning and understanding other engineering disciplines (software, firmware, mechanical, acoustic)
• Broad exposure to many engineering disciplines: Electrical, Mechanical, Software, Systems, Acoustics
• Strong written and oral communication skills in both English and Mandarin, and strong interpersonal skills
• Ability to work with others in a widely-disbursed, fast-paced team environment
• Excellent time management and organizational skills
HIGHLY DISIRERABLE
• Experience/knowledge of RF design and antenna design for wireless systems
• Experience /knowledge of embedded system design and coding
• Experience working with global engineering team and product management to define products and make tradeoffs
• Experience mentoring junior engineers for technical skills and soft skills
工作地点
地址:苏州苏州工业园区苏州-工业园区缤特力通讯科技公司
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职位发布者
HR
中国惠普有限公司
![](http://img.jrzp.com/jrzpfile/provincercw/images/sfrz_yrz.png)
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计算机硬件·网络设备
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1000人以上
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中外合资(合资·合作)
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朝阳区建国路112号中国惠普大厦
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